• Associate Professor, Engineering Technology & Industrial Distribution,
  • Manufacturing & Mechanical Engineering Technology
  • Affiliated Faculty, Mechanical Engineering
Xianming Simon Dai

Educational Background

  • Ph.D., Mechanical Engineering, The University of South Carolina, 2013
  • M.S., Thermal Engineering, Huazhong University of Science and Technology, 2009
  • B.S., Thermal Energy and Power Engineering, Chongqing University, 2007

Research Interests

    • Thermal Packaging

    • Semiconductor Manufacture

    • Heat Transfer

    • Microfluidics

    • Water Energy Nexus

Awards & Honors

  • DARPA Director’s Fellowship, 2025
  • DARPA Young Faculty Award, 2023
  • National Science Foundation CAREER Award, 2021
  • Army Research Office Young Investigator Award, 2019

Selected Publications

  • L. Shan, J.W. Kwak, F. Chen, K. Wyke, D. Boylan, D. Monga, X. Jiang, D.B. Ma, X. Dai, "Sustainable Vaporization for Electronics Cooling via Dynamic Fluid Delivery", Device, 6, 100812 (2025)
  • D. Monga, D. Boylan, D.B. Suresh, J. Sarma, Y. Jin, P. Wang, X. Dai, "Dynamic condensation model of rolling droplets for high-performance heat transfer", Newton, 1(2), 100033 (2025)
  • L. Shan, Z. Guo, D. Monga, D. Boylan, X. Dai, "Microchannel-elevated micromembrane for sustainable phase-separation condensation", Joule, 7(1), 168-182 (2023)
  • D. Boylan, D. Monga, L. Shan, Z. Guo, X. Dai, "Pushing the Limit of Beetle-Inspired Condensation on Biphilic Quasi-Liquid Surfaces", Advanced Functional Materials, 33(11), 2211113 (2023)
  • Z. Guo, D. Boylan, L. Shan, X. Dai, "Hydrophilic reentrant SLIPS enabled flow separation for rapid water harvesting", Proceedings of the National Academy of Sciences, 119(36), e2209662119 (2022)